The second connection layer 92 and the second end portion 70E2 of the common power supply line 70 may be connected through a first contact hole CH1 formed in the inorganic insulating layer 109. The second connection layer 92 may be connected through a second contact hole CH2 formed in the second interlayer insulating layer 107. As shown in FIG. 5, the first contact hole CH1 and the second contact hole CH2 may overlap each other.

Even if the first contact hole CH1 and the second contact hole CH2 were to not overlap each other, as in some implementations, the first contact hole CH1 and the second contact hole CH2 do not overlap the seal 400. When the first contact hole CH1 and the second contact hole CH2, providing a path through which heat applied in forming the seal 400 is diffused, do not overlap the seal 400, higher heat diffusion efficiency may be achieved.

Positions of the first contact hole CH1 and the second contact hole CH2 may be determined by a position of the second connection layer 92. Accordingly, when the first contact hole CH1 and the second contact hole CH2 do not overlap the seal 400, the second connection layer 92 may also not overlap the seal 400. For example, the second connection layer 92 may be located between an inner surface 400IE of the seal 400 and the first scan driving circuit 20.