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Display apparatus

專利號(hào)
US11177464B2
公開日期
2021-11-16
申請(qǐng)人
SAMSUNG DISPLAY CO., LTD.(KR Yongin-si)
發(fā)明人
Takyoung Lee; Jaewook Kang; Yunmo Chung
IPC分類
H01L27/32; H01L51/52
技術(shù)領(lǐng)域
layer,thermally,may,conductive,driving,display,line,first,substrate,supply
地域: Yongin-si

摘要

A display apparatus includes a lower substrate including a peripheral area around a display area, an upper substrate facing the lower substrate, a display unit in the display area including a pixel circuit and a display device electrically connected to the pixel circuit, a seal in the peripheral area to surround the display unit, the seal adhering the lower substrate to the upper substrate, a power supply line between the lower substrate and the seal such that at least a portion of the power supply line and the seal overlap each other, and a first thermally conductive layer between the power supply line and the lower substrate, at least a part of the first thermally conductive layer overlapping an end portion of the power supply line, the first thermally conductive layer being connected to the power supply line and extending toward an edge of the lower substrate.

說明書

FIG. 6 illustrates a plan view of a portion of a display apparatus 1A according to an embodiment. FIG. 7 illustrates a plan view of a part of a display apparatus 1B according to an embodiment. FIGS. 6 and 7 illustrate plan views of a structure of the first thermally conductive layer 80 overlapping the first end portion 70E1 of the common power supply line 70.

Referring to FIG. 6, at least a part of the first thermally conductive layer 80 may overlap the common power supply line 70. The first connection layer 82 may be located between the first thermally conductive layer 80 and the common power supply line 70. The end surface 80E of the first thermally conductive layer 80 may be aligned with the edge 100E of the lower substrate 100 and may be exposed to the outside, as shown in FIG. 3.

In FIG. 6, a left portion of the common power supply line 70 and a right portion of the first thermally conductive layer 80 may overlap each other. The first connection layer 82 may be located in overlapping portions of the common power supply line 70 and the first thermally conductive layer 80. The first connection layer 82 may be connected to the common power supply line 70 and the first thermally conductive layer 80 through a contact hole CH.

權(quán)利要求

1
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