FIG. 8 illustrates is a plan view of a display apparatus 1B′ that is a modification of FIG. 7, illustrating a step before a cutting process. Referring to FIG. 8, the end surface 80E of the first thermally conductive layer 80 may be aligned with the cutting line CL. Accordingly, it is desirable that patterns of the first thermally conductive layer 80 be formed to correspond to the cutting line CL. Defects due to difficulty in cutting the first thermally conductive layer 80 during a cutting process may be reduced or prevented by continuously forming hole patterns HP in a portion corresponding to the cutting line CL. Heat dissipation efficiency of the first thermally conductive layer 80 may be improved by minimizing the area of the hole patterns HP formed in the portion corresponding to the cutting line CL to maximize the area of the first thermally conductive layer 80.

FIG. 9 illustrates a plan view of a part of a display apparatus 1C according to an embodiment. FIG. 9 illustrates a plan view of a structure of the second thermally conductive layer 90 overlapping the second end portion 70E2 of the common power supply line 70.

In FIG. 9, a right portion of the common power supply line 70 and the second thermally conductive layer 90 completely overlap each other. The second connection layer 92 is located between the common power supply line 70 and the second thermally conductive layer 90. The second connection layer 92 is connected to the common power supply line 70 and the second thermally conductive layer 90 through a contact hole CH.