Meanwhile, the fan-out semiconductor package refers to package technology for mounting the semiconductor chip on the mainboard of the electronic device, or the like, as described above, and protecting the semiconductor chip from external impacts, and is a concept different from that of a printed circuit board (PCB) such as an interposer substrate, or the like, having a scale, a purpose, and the like, different from those of the fan-out semiconductor package, and having the fan-in semiconductor package embedded therein.

Antenna Module

FIG. 9 is a schematic cross-sectional view illustrating an antenna module according to an exemplary embodiment in the present disclosure.

Referring to FIG. 9, an antenna module 500A according to an exemplary embodiment in the present disclosure may include an antenna substrate 100A, a semiconductor package 200A disposed on a lower surface of the antenna substrate 100A and electrically connected to the antenna substrate 100A, an electronic component 300 disposed on the lower surface of the antenna substrate 100A and electrically connected to the antenna substrate 100A, and a connector 410 disposed beneath the antenna substrate 100A and connected to the antenna substrate 100A. In this case, a thickness t1 of the electronic component 300 may be greater than thicknesses t2 and t3 of semiconductor chips 221 and 222. The thickness t1 of the electronic component 300 may be greater than a thickness t4 of the semiconductor package 200A. The thickness t4 of the semiconductor package 200A refers to a thickness except for an electrical connection structure 260 such as a solder ball.