Antenna module
摘要
說明書
Recently, in accordance with the trend toward thinness of electronic devices, thicknesses of various components in a mobile device such as a smartphone are significantly limited. Therefore, when a millimeter wave/5G antenna module is used in the mobile device, inevitably there are many limitations in a size, a thickness, and the like, of the millimeter wave/5G antenna module antenna module in order to secure a degree of freedom of a mounting position of the millimeter wave/5G antenna module within a set.
Meanwhile, when an antenna module is implemented in a general system-in-package (SIP) type module manner, various semiconductor chips and passive components are mounted on a bottom surface of an antenna substrate by surface mount technology (SMT), and in order to prevent electromagnetic interference (EMI), a shield can covering the semiconductor chips and the passive components is attached to the semiconductor chips and the passive components or the semiconductor chips and the passive components are covered with an epoxy molding compound (EMC), and a metal layer is then formed on an outer surface of the EMC. In this case, since an overall thickness of the module is determined by a passive component, particularly, a component having a great thickness, such as a power inductor (PI), there is a limitation in reducing the overall thickness of the module unless a thickness of the power inductor is reduced or a method of mounting the power inductor is changed.
