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Antenna module

專利號
US11177551B2
公開日期
2021-11-16
申請人
SAMSUNG ELECTRONICS CO., LTD.(KR Suwon-si)
發(fā)明人
Won Wook So; Jin Seon Park; Young Sik Hur; Jung Chul Gong; Yong Ho Baek
IPC分類
H01Q1/22; H01Q1/24; H01L23/00; H01L23/66; H01L23/31; H01L23/522
技術(shù)領(lǐng)域
antenna,may,insulating,wiring,layer,package,212a,212b,be,connection
地域: Suwon-si

摘要

An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.

說明書

The antenna patterns 112A of the wiring layers 112 may be disposed on an upper surface of the core layer 111a, and the ground patterns 112G of the wiring layers 112 may be disposed on a lower surface of the core layer 111a. The antenna patterns 112A may be disposed, respectively, on the insulating layers 111b built-up on the core layer 111a. The antenna patterns 112A disposed, respectively, on the insulating layers 111b built-up on the core layer 111a may be disposed directly above or below each other and be coupled to each other. For example, the antenna patterns 112A may form a capacitance. However, a disposition of the antenna patterns 112A may be changed depending on a type of antenna, and the insulating layers 111b may be built-up only beneath the core layer 111a, if necessary. In this case, the antenna patterns 112A formed on the insulating layers 111b built-up on the core layer 111a may be omitted.

權(quán)利要求

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