Antenna module
摘要
說明書
The passivation layers 111c1 and 111c2 may be disposed on outermost layers of the antenna substrate 100A to protect internal components of the antenna substrate 100A. Each of the passivation layers 111c1 and 111c2 may also include an insulating material, for example, an ABF, but is not limited thereto. Openings (not denoted by reference numeral) exposing at least portions of the wiring layer 112 in order to electrically connect the wiring layer 112 to the electronic component 300 and/or the connector 410 may be formed in a lower passivation layer 111c1.
The wiring layers 112 may include the antenna patterns 112A substantially implementing the millimeter wave/5G antenna, and may include other ground patterns 112G, feeding patterns 112F, and the like. The antenna patterns 112A may be a dipole antenna, a patch antenna, or the like, depending on a disposition and a shape of the antenna patterns 112A. The ground patterns 112G may have a ground plane form. The antenna patterns 112A may be surrounded by ground patterns (not illustrated) disposed on the same level, but are not limited thereto. The wiring layers 112 may include signal patterns, power patterns, resistor patterns, or the like. A material of each of the wiring layers 112 may be a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but is not limited thereto.
