Antenna module
摘要
說(shuō)明書
The connection via layers 113 may electrically connect the wiring layers 112 formed on different layers to each other, resulting in an electrical path in the antenna substrate 100A. The connection via layers 113 may include the feeding vias 113F, and may include ground connection vias, or the like. The connection via layers 113 may further include signal connection vias, power connection vias, or the like. The feeding vias 113F may be connected to the antenna patterns 112A in an electrical manner and/or a signal manner. Some ground connection vias (not illustrated) may tightly surround the feeding vias 113F. A material of each of the connection via layers 113 may be a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. A connection via of each of the connection via layers 113 may be completely filled with the conductive material, or the conductive material may be formed along a wall of each of via holes unlike illustrated in the drawing. In addition, each of the connection via layers may have all of any known vertical cross-sectional shapes such as a cylindrical shape, an hourglass shape, a tapered shape, or the like.
