Antenna module
摘要
說明書
The wiring layers 212a and 212b may serve to redistribute the connection pads 221P and 222P of the semiconductor chips 221 and 222. In addition, the wiring layers 212a and 212b may be used as connection patterns when the semiconductor package 200A is electrically connected to other components disposed on and beneath the semiconductor package 200A. A material of each of the wiring layers 212a and 212b may be a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The wiring layers 212a and 212b may perform various functions depending on designs of corresponding layers. For example, the wiring layers 212a and 212b may include ground (GND) patterns, power (PWR) patterns, signal (S) patterns, and the like. Here, the signal (S) patterns may include various signals except for the ground (GND) patterns, the power (PWR) patterns, and the like, such as data signals, and the like. In addition, the wiring layers 212a and 212b may include via pads, and the like.
