Antenna module
摘要
說明書
The connection vias 213 may electrically connect the wiring layers 212a and 212b formed on different layers to each other, resulting in an electrical path in the frame 210. A material of each of the connection vias 213 may be a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Each of the connection vias 213 may be completely filled with the conductive material, or the conductive material may be formed along a wall of each of connection via holes. In addition, each of the connection vias 213 may have any known shape such as an hourglass shape, a cylindrical shape, and the like. The connection vias 213 may also include signal connection vias, ground connection vias, and the like.
