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Antenna module

專(zhuān)利號(hào)
US11177551B2
公開(kāi)日期
2021-11-16
申請(qǐng)人
SAMSUNG ELECTRONICS CO., LTD.（KR Suwon-si）
發(fā)明人
Won Wook So; Jin Seon Park; Young Sik Hur; Jung Chul Gong; Yong Ho Baek
IPC分類(lèi)
H01Q1/22; H01Q1/24; H01L23/00; H01L23/66; H01L23/31; H01L23/522
技術(shù)領(lǐng)域
antenna,may,insulating,wiring,layer,package,212a,212b,be,connection
地域： Suwon-si

摘要

An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.

說(shuō)明書(shū)

The encapsulant 230 may be configured to protect the semiconductor chips 221 and 222, the passive components 225, and the like, and provide an insulating region. An encapsulation form of the encapsulant 230 is not particularly limited, and may be a form in which the encapsulant 230 surrounds at least portions of the semiconductor chips 221 and 222 and the passive components 225. For example, the encapsulant 230 may cover the lower surface of the frame 210, cover side surfaces and the inactive surfaces of the semiconductor chips 221 and 222, and cover side surfaces and lower surfaces of the passive components 225. In addition, the encapsulant 230 may fill spaces in the through-holes 210HA, 210HB, and 210HC. Certain materials of the encapsulant 230 are not particularly limited, and may be, for example, an insulating material such as an ABF, or the like. Alternatively, a photoimagable encapsulant (PIE) may be used as the material of the encapsulant 230. If necessary, the encapsulant 230 may include a plurality of encapsulants such as a first encapsulant encapsulating the passive components 225, a second encapsulant encapsulating the semiconductor chips 221 and 222, and the like.

權(quán)利要求

1
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