Antenna module
摘要
說明書
The connection structure 240 may redistribute the connection pads 221P and 222P of the semiconductor chips 221 and 222. Several tens to several hundreds of connection pads 221P and 222P of the semiconductor chips 221 and 222 having various functions may be redistributed by the connection structure 240. In addition, the connection structure 240 may electrically connect the connection pads 221P and 222P of the semiconductor chips 221 and 222 to the passive components 225. In addition, the connection structure 240 may provide an electrical connection path between the semiconductor package 200A and the antenna substrate 100A. The connection structure 240 may include an insulating layer 241, a redistribution layer 242 disposed on the insulating layer 241, and redistribution vias 243 penetrating through the insulating layer 241 and connected to the redistribution layer 242. The connection structure 240 may be formed of a single layer, or may be formed of a plurality of layers of which the number is greater than that illustrated in the drawing.
