Referring to FIG. 10, in an antenna module 500B according to another exemplary embodiment, a recess portion 100h may be formed in a lower side of an antenna substrate 100B, and an electronic component 300 may be disposed in the recess portion 100h of the antenna substrate 100B. In detail, the antenna substrate 100B may have the recess portion 100h penetrating through a lower passivation layer 111c1 and penetrating through at least a portion of a lower build-up insulating layer 111b, and the electronic component 300 may be mounted on an exposed inner wiring layer 112 of the recess portion 100h using a solder adhesive, or the like, and be electrically connected to the exposed inner wiring layer 112. That is, the electronic component 300 may be directly connected to the inner wiring layer 112 of the antenna substrate 100B rather than an outer layer of the antenna substrate 100B such that a thickness occupied by the electronic component 300 in the antenna module 500B may be reduced. Resultantly, an overall thickness of the antenna module 500B may further be reduced. Other configurations overlap those described above in the antenna module 500A according to the exemplary embodiment, and a detailed description thereof is thus omitted.
FIG. 11 is a schematic cross-sectional view illustrating an antenna module according to another exemplary embodiment in the present disclosure.
