Antenna module
摘要
說明書
The connection vias 213a and 213b may electrically connect the wiring layers 212a, 212b, and 212c formed on different layers to each other, resulting in an electrical path in the frame 210. A material of each of the connection vias 213a and 213b may be a conductive material. Each of the connection vias 213a and 213b may be completely filled with the conductive material, or the conductive material may be formed along a wall of each of via holes. In addition, each of the connection vias 213a and 213b may have a tapered shape of which a direction is opposite to that of each of redistribution vias 243 of the connection structure 240. When holes for the first connection vias 213a are formed, some of the pads of the first wiring layer 212a may serve as a stopper, and it may thus be advantageous in a process that each of the first connection vias 213a has the tapered shape of which a width of a lower surface is greater than that of an upper surface. In this case, the first connection vias 213a may be integrated with pad patterns of the second wiring layer 212b. In addition, when holes for the second connection vias 213b are formed, some of the pads of the second wiring layer 212b may serve as a stopper, and it may thus be advantageous in a process that each of the second connection vias 213b has the tapered shape of which a width of a lower surface is greater than that of an upper surface. In this case, the second connection vias 213b may be integrated with pad patterns of the third wiring layer 212c.
