Antenna module
地域：
Suwon-si
摘要
An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.
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A structure of the semiconductor package 200B according to another exemplary embodiment may be applied to the antenna module 500A, 500B, 500C, or 500D described above. Other configurations overlap those described above in the semiconductor package 200A according to the exemplary embodiment, and a description thereof is thus omitted.
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