Referring to FIG. 15, an electronic component 300 may be used in a form of a packaged component 310 in the antenna module 500A, 500B, 500C, or 500D described above. The packaged component 310 may include the electronic component 300; an encapsulant 330 covering at least portions of the electronic component 300; a wiring structure 340 including an insulating layer 341 formed beneath the electronic component 300, a wiring layer 342 formed on a lower surface of the insulating layer 341, and connection vias 343 penetrating through the insulating layer 341 and electrically connecting electrodes of the electronic component 300 and the wiring layer 342 to each other; a passivation layer 350 disposed beneath the wiring structure 340 and having openings exposing at least portions of the wiring layer 342, electrical connection structures 360 disposed on the exposed openings of the passivation layer 350 and connected to the wiring layer 342; and a metal layer 370 formed on outer surfaces of the encapsulant 330. That is, the electronic component 300 may be disposed in a packaged state. In this case, electromagnetic waves generated from the electronic component 300 or electromagnetic waves introduced from an external source into the electronic component 300 may be effectively shielded through the metal layer 370.
