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Antenna module

專利號
US11177551B2
公開日期
2021-11-16
申請人
SAMSUNG ELECTRONICS CO., LTD.(KR Suwon-si)
發(fā)明人
Won Wook So; Jin Seon Park; Young Sik Hur; Jung Chul Gong; Yong Ho Baek
IPC分類
H01Q1/22; H01Q1/24; H01L23/00; H01L23/66; H01L23/31; H01L23/522
技術領域
antenna,may,insulating,wiring,layer,package,212a,212b,be,connection
地域: Suwon-si

摘要

An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.

說明書

Referring to FIG. 1, an electronic device 1000 may accommodate a mainboard 1010 therein. The mainboard 1010 may include chip related components 1020, network related components 1030, other components 1040, and the like, physically or electrically connected thereto. These components may be connected to others to be described below to form various signal lines 1090.

The chip related components 1020 may include a memory chip such as a volatile memory (for example, a dynamic random access memory (DRAM)), a non-volatile memory (for example, a read only memory (ROM)), a flash memory, or the like; an application processor chip such as a central processor (for example, a central processing unit (CPU)), a graphics processor (for example, a graphics processing unit (GPU)), a digital signal processor, a cryptographic processor, a microprocessor, a microcontroller, or the like; and a logic chip such as an analog-to-digital (ADC) converter, an application-specific integrated circuit (ASIC), or the like. However, the chip related components 1020 are not limited thereto, but may also include other types of chip related components. In addition, the chip related components 1020 may be combined with each other.

權(quán)利要求

1
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