Antenna module
摘要
說明書
A material of the encapsulant 330 may be any known insulating material such as an ABF, an EMC, or the like. A material of the insulating layer 341 may be any known insulating material such as an ABF, a PID, or the like. A material of each of the wiring layer 342 and the connection via 343 may be any known conductive material such as copper (Cu), or the like. A material of the passivation layer 350 may be any known insulating material such as an ABF, a solder resist, or the like. A material of each of the electrical connection structures 360 may be a low melting point metal such as a solder. A material of the metal layer 370 may be any known metal such as copper (Cu).
As set forth above, according to an exemplary embodiment in the present disclosure, an antenna module of which a degree of freedom may be secured when the antenna module is mounted in a set by a reduction in an overall thickness thereof may be provided.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims.
