Chip-scale radio-frequency localization devices and associated systems and methods
地域：
MA
MA Waltham
摘要
A device comprising: a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency; a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency different than the first center frequency; and circuitry integrated with the semiconductor die and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna.
說明書
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This application is a continuation of and claims the benefit under 35 U.S.C. § 120 of U.S. patent application Ser. No. 15/382,582 entitled “CHIP-SCALE RADIO-FREQUENCY LOCALIZATION DEVICES AND ASSOCIATED SYSTEMS AND METHODS,” filed Dec. 16, 2016, which claims the benefit under 35 U.S.C. § 119 to U.S. Provisional Application Ser. No. 62/268,741, titled “FREQUENCY-SHIFT TRANSPONDER,” filed on Dec. 17, 2015; U.S. Provisional Application Ser. No. 62/268,745, titled “RADAR ON A CHIP,” filed on Dec. 17, 2015; U.S. Provisional Application Ser. No. 62/275,400, titled “HIGH-PRECISION POSITIONING SYSTEM FOR A GROUND PENETRATING RADAR SYSTEM,” filed on Jan. 6, 2016; U.S. Provisional Application Ser. No. 62/306,469, titled “HIGH-PRECISION TIME OF FLIGHT MEASUREMENT SYSTEM FOR PICKING AND PACKING,” filed on Mar. 10, 2016; U.S. Provisional Application Ser. No. 62/306,478, titled “HIGH-PRECISION TIME OF FLIGHT MEASUREMENT SYSTEM FOR MICRONAVIGATION AND LOCALIZATION,” filed on Mar. 10, 2016; and U.S. Provisional Application Ser. No. 62/306,483, titled “HIGH-PRECISION TIME OF FLIGHT MEASUREMENT SYSTEM ON A CHIP,” filed on Mar. 10, 2016, each of which is incorporated by reference herein in its entirety.
權利要求
What is claimed is:1. A device comprising:a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit, to a target device different from the device, first radio-frequency (RF) signals; a receive antenna fabricated on the substrate and configured to receive, from the target device, second RF signals; circuitry integrated with the semiconductor die and comprising a frequency divider and a mixer, wherein the frequency divider has an input coupled to the receive antenna and an output, and wherein the mixer has an input and an output, the input of the mixer being coupled to the output of the frequency divider; and at least one processor configured to receive data obtained using the output of the mixer and to determine a distance between the device and the target device using the data. 2. The device of claim 1 , wherein the input of the mixer is a first input of the mixer, and the mixer has a second input coupled to a waveform generator. 3. The device of claim 1 , wherein the device is a packaged device comprising:first level connections formed by flip-chip bonding the semiconductor die to the substrate; second level connections configured to connect the packaged device to a printed circuit board; and a protective encapsulation for at least the semiconductor die. 4. The device of claim 1 , wherein the first RF signals are circularly polarized in a first rotational direction, and the second RF signals are circularly polarized in a second rotational direction different from the first rotational direction. 5. The device of claim 1 , wherein the substrate comprises a printed circuit board having at least one conductive layer, and wherein the transmit antenna and the receive antenna are fabricated on the substrate by patterning the at least one conductive layer. 6. The device of claim 1 , wherein the first RF signals have a first center frequency equal to or greater than 50 GHz, and the second RF signals have a second center frequency different from the first center frequency. 7. The device of claim 6 , wherein the second center frequency is greater than and is a harmonic of the first center frequency. 8. The device of claim 6 , wherein the first center frequency is between 50 GHz and 240 GHz. 9. The device of claim 8 , wherein the first center frequency is between 50 GHz and 70 GHz. 10. A device comprising:a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit, to a target device different from the device, first radio-frequency (RF) signals; a receive antenna fabricated on the substrate and configured to receive, from the target device, second RF signals; circuitry integrated with the semiconductor die and comprising a frequency divider and a mixer, wherein the frequency divider has an input coupled to the receive antenna and an output, and wherein the mixer has an input and an output, the input of the mixer being coupled to the output of the frequency divider; and at least one processor configured to receive data obtained using the output of the mixer and to determine a time-of-flight between the device and the target device using the data. 11. The device of claim 10 , wherein the input of the mixer is a first input of the mixer, and the mixer has a second input coupled to a waveform generator. 12. The device of claim 10 , wherein the first RF signals have a first center frequency equal to or greater than 50 GHz, and the second RF signals have a second center frequency different from the first center frequency. 13. The device of claim 12 , wherein the second center frequency is greater than and is a harmonic of the first center frequency. 14. The device of claim 12 , wherein the first center frequency is between 50 GHz and 70 GHz. 15. The device of claim 10 , wherein the first RF signals are circularly polarized in a first rotational direction, and the second RF signals are circularly polarized in a second rotational direction different from the first rotational direction.
意見反饋