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Antenna and electronic device comprising same

專利號
US11177556B2
公開日期
2021-11-16
申請人
Samsung Electronics Co., Ltd.（KR Suwon-si）
發(fā)明人
Seunggil Jeon; Jeongheum Lee; Jaebong Chun
IPC分類
H01Q1/24; H01Q9/16; H01Q21/06; H01Q9/30
技術(shù)領(lǐng)域
may,antenna,device,electronic,millimeter,wave,be,or,fpc,radiation
地域： Gyeonggi-do

摘要

Disclosed is an electronic device including a housing including a front surface, a rear surface, and a side member, a rigid printed circuit board including a first ground, a flexible printed circuit board including a second ground and extended toward the side surface from one end of the rigid printed circuit board, a plurality of antenna elements mounted on the flexible printed circuit board and radiating a millimeter wave signal, a support member fixing the flexible printed circuit board to be at a predetermined angle with the rear surface, and a communication circuit, the first ground and the second ground allows a radiation pattern of the millimeter wave signal to have directivity in a direction of the side surface, by shielding a component, which is radiated toward at least part of the front surface or the rear surface, of a millimeter wave signal radiated from the plurality of radiators.

說明書

According to an embodiment, when viewed from above the front plate of the electronic device, the first communication device 721 may be positioned at a left top end of the electronic device 700, the second communication device 722 may be positioned at a right top end of the electronic device 700, the third communication device 723 may be positioned at a left bottom end of the electronic device 700, and the fourth communication device 700 may be positioned at a right bottom end of the electronic device 700.

According to an embodiment, the processor 740 may include one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an image signal processor of a camera, or a baseband processor (or a communication processor (CP)). According to an embodiment, the processor 740 may be implemented with a system on chip (SoC) or a system in package (SiP).

權(quán)利要求

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