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Antenna and electronic device comprising same

專利號(hào)
US11177556B2
公開日期
2021-11-16
申請(qǐng)人
Samsung Electronics Co., Ltd.(KR Suwon-si)
發(fā)明人
Seunggil Jeon; Jeongheum Lee; Jaebong Chun
IPC分類
H01Q1/24; H01Q9/16; H01Q21/06; H01Q9/30
技術(shù)領(lǐng)域
may,antenna,device,electronic,millimeter,wave,be,or,fpc,radiation
地域: Gyeonggi-do

摘要

Disclosed is an electronic device including a housing including a front surface, a rear surface, and a side member, a rigid printed circuit board including a first ground, a flexible printed circuit board including a second ground and extended toward the side surface from one end of the rigid printed circuit board, a plurality of antenna elements mounted on the flexible printed circuit board and radiating a millimeter wave signal, a support member fixing the flexible printed circuit board to be at a predetermined angle with the rear surface, and a communication circuit, the first ground and the second ground allows a radiation pattern of the millimeter wave signal to have directivity in a direction of the side surface, by shielding a component, which is radiated toward at least part of the front surface or the rear surface, of a millimeter wave signal radiated from the plurality of radiators.

說明書

According to an embodiment, the first BP or the second BP may provide an interface for performing communication with any other entities. The first BP may support, for example, wireless communication with regard to a first network (not illustrated). The second BP may support, for example, wireless communication with regard to a second network (not illustrated).

According to an embodiment, the first BP or the second BP may form one module with the processor 740. For example, the first BP or the second BP may be integrally formed with the processor 740. For another example, the first BP or the second BP may be disposed in one chip or may be implemented in the form of an independent chip. According to an embodiment, the processor 740 and at least one baseband processor (e.g., the first BP) may be integrally formed within one chip (e.g., SoC), and another baseband processor (e.g., the second BP) may be implemented in the form of an independent chip.

According to an embodiment, the first network (not illustrated) or the second network (not illustrated) may correspond to the network 699 of FIG. 6. According to an embodiment, the first network (not illustrated) and the second network (not illustrated) may include a 4th generation (4G) network and a 5th generation (5G) network, respectively. The 4G network may support, for example, a long term evolution (LTE) protocol defined in the 3GPP. The 5G network may support, for example, a new radio (NR) protocol defined in the 3 GPP.

FIG. 8 is a block diagram of a communication device according to an embodiment.

權(quán)利要求

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