According to an embodiment, the first antenna array 840 or the second antenna array 845 may include a plurality of antenna elements. The plurality of antenna elements may include a patch antenna or a dipole antenna. For example, an antenna element included in the first antenna array 840 may be a patch antenna for forming a beam toward the back plate of the electronic device 700. For another example, an antenna element included in the second antenna array 845 may be a dipole antenna for forming a beam toward a side member of the electronic device 700.

According to an embodiment, the communication circuit 830 may support at least part (e.g., 24 GHz to 30 GHz or 37 GHz to 40 GHz) of a band ranging from 24 GHz to 100 GHz. According to an embodiment, the communication circuit 830 may up-convert or down-convert a frequency. For example, the communication circuit 830 included in the communication device 800 (e.g., the first communication device 721 of FIG. 7) may up-convert an IF signal received from a communication module (e.g., the communication module 750 of FIG. 7) through a conductive line (e.g., the first conductive line 731 of FIG. 7) to an RF signal. For another example, the communication circuit 830 included in the communication device 800 (e.g., the first communication device 721 of FIG. 7) may down-convert an RF signal (e.g., a millimeter wave signal) received through the first antenna array 840 or the second antenna array 845 into an IF signal and may transmit the IF signal to a communication module by using a conductive line.