According to various embodiments, with reference to the shielding member (e.g., the shielding member 300 in FIG. 2) of the electronic device (e.g., the electronic device 10 in FIG. 2), the first coil 210 may include a first layer 211 and a second layer 212 disposed above the first layer 211 (e.g., in the second direction (+Z)). The first layer 211 and the second layer 212 are connected to each other, and may be provided as a flat helical coil having a multilayer structure. According to an embodiment, the second coil 220 may be disposed on a first face (e.g., the first face 110A in FIG. 2) of the electronic device 10. For example, the second layer 212 is disposed on the first face 110A, and may be substantially coplanar with the third layer 221. The third layer 221 may be provided has a flat helical coil having a single-layer structure. According to an embodiment, the shielding member 300 may be disposed on a portion of the second coil 220. For example, the shielding member 300 may be disposed in a region below the third layer 221 of the second coil 220 along the edge region of the first layer 211 of the first coil 210.
