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Stacked coil structure and electronic device including the same

專(zhuān)利號(hào)
US11177666B2
公開(kāi)日期
2021-11-16
申請(qǐng)人
Samsung Electronics Co., Ltd.(KR Suwon-si)
發(fā)明人
Keumsu Song; Kwangseob Kim; Kihyun Kim; Dongzo Kim; Jiwon Kim; Jihye Kim; Yunjeong Noh; Changhak O; Hyungkoo Chung; Mincheol Ha; Jongchul Hong; Yongsang Yun
IPC分類(lèi)
H01F17/00; H01F38/14; H02J5/00; H02J50/12; H02J50/40; H02J50/70; H02J7/02; H04B5/00
技術(shù)領(lǐng)域
coil,layer,may,power,first,turns,circuit,electronic,second,device
地域: Suwon-si

摘要

An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.

說(shuō)明書(shū)

According to an embodiment, the first layer 211 may include a plurality of layers. For example, the first layer 211 may include a (1-1)th layer 211a and a (1-2)th layer 211b disposed below the (1-1)th layer 211a. The (1-1)th layer 211a and the (1-2)th layer 211b may be provided in a ring shape in which one wire is wound in a helical shape and may have a structure of stacked layers connected to each other. According to an embodiment, the number of turns of the (1-1)th layer 211a may be the same as the number of turns of the (1-2)th layer 211b. For example, the (1-1)th layer 211a and the (1-2)th layer 211b may be helically wound at least five times around the central axis O.

權(quán)利要求

1
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