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Stacked coil structure and electronic device including the same

專利號
US11177666B2
公開日期
2021-11-16
申請人
Samsung Electronics Co., Ltd.(KR Suwon-si)
發(fā)明人
Keumsu Song; Kwangseob Kim; Kihyun Kim; Dongzo Kim; Jiwon Kim; Jihye Kim; Yunjeong Noh; Changhak O; Hyungkoo Chung; Mincheol Ha; Jongchul Hong; Yongsang Yun
IPC分類
H01F17/00; H01F38/14; H02J5/00; H02J50/12; H02J50/40; H02J50/70; H02J7/02; H04B5/00
技術(shù)領(lǐng)域
coil,layer,may,power,first,turns,circuit,electronic,second,device
地域: Suwon-si

摘要

An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.

說明書

According to various embodiments, the first shape according to the first number of turns of the first layer 211 may correspond to the fourth shape according to the fourth number of turns of the fourth layer 222. For example, the first shape of the first layer 211 and the fourth shape of the fourth layer 222 may be the same as each other. As another example, the second shape according to the second number of turns of the second layer 212 may correspond to the third shape according to the third number of turns of the third layer 221. For example, the second shape of the second layer 212 and the third shape of the third layer 221 may be the same as each other.

權(quán)利要求

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