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Stacked coil structure and electronic device including the same

專利號(hào)
US11177666B2
公開日期
2021-11-16
申請(qǐng)人
Samsung Electronics Co., Ltd.（KR Suwon-si）
發(fā)明人
Keumsu Song; Kwangseob Kim; Kihyun Kim; Dongzo Kim; Jiwon Kim; Jihye Kim; Yunjeong Noh; Changhak O; Hyungkoo Chung; Mincheol Ha; Jongchul Hong; Yongsang Yun
IPC分類
H01F17/00; H01F38/14; H02J5/00; H02J50/12; H02J50/40; H02J50/70; H02J7/02; H04B5/00
技術(shù)領(lǐng)域
coil,layer,may,power,first,turns,circuit,electronic,second,device
地域： Suwon-si

摘要

An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.

說明書

According to various embodiments, in the first coil 210, at least a portion of the first layer 211 may be exposed to the outside of the second layer 212 when viewed from above the second layer 212 (in the second direction (?Z)). Since the outer diameter D2 of the second layer 212 is larger than the outer diameter D1 of the first layer 211, the wire deposed in the region adjacent to the outer diameter D2 of the second layer 212 may be exposed to the top face and the rear face of the first coil 210. According to an embodiment, in the second coil 220, at least a portion of the third layer 221 may be exposed to the inner diameter d4 of the fourth layer 222 when viewed from above the fourth layer 222 (in the second direction (?Z)). Since the inner diameter d4 of the fourth layer 222 is larger than the inner diameter d3 of the third layer 221, the wire deposed in the region adjacent to the inner diameter d3 of the third layer 221 may be exposed to the top face and the rear face of the second coil 220.

According to various embodiments, it is possible to improve wireless power transmission efficiency through a transmission coil having a multi-layer structure according to the first coil 210 and the second coil 220.

FIG. 12 is a cross-sectional view illustrating the structure of a coil unit according to another embodiment of the disclosure. FIG. 13 is a schematic view illustrating the structure of the coil unit of FIG. 12, which is viewed from above according to another embodiment of the disclosure.

權(quán)利要求

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