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Stacked coil structure and electronic device including the same

專(zhuān)利號(hào)
US11177666B2
公開(kāi)日期
2021-11-16
申請(qǐng)人
Samsung Electronics Co., Ltd.（KR Suwon-si）
發(fā)明人
Keumsu Song; Kwangseob Kim; Kihyun Kim; Dongzo Kim; Jiwon Kim; Jihye Kim; Yunjeong Noh; Changhak O; Hyungkoo Chung; Mincheol Ha; Jongchul Hong; Yongsang Yun
IPC分類(lèi)
H01F17/00; H01F38/14; H02J5/00; H02J50/12; H02J50/40; H02J50/70; H02J7/02; H04B5/00
技術(shù)領(lǐng)域
coil,layer,may,power,first,turns,circuit,electronic,second,device
地域： Suwon-si

摘要

An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.

說(shuō)明書(shū)

According to an embodiment, at least a portion of the fifth layer 231 may be disposed to overlap at least a portion of the sixth layer 232. As another example, at least a portion of the fifth layer 231 and at least a portion of the fourth layer 222 may be disposed to overlap each other. According to an embodiment, the third coil 230 corresponds to the second coil 220 in shape, and may be provided in a 180-degree-reversed configuration so as to be fitted to each other. For example, the third layer 221 and the fifth layer 231 may be substantially coplanar with each other, and the fourth layer 222 and the sixth layer 232 may be substantially coplanar with each other. A stepped shape generated according to the sizes of the diameters of the third layer 221 and the fourth layer 222 is disposed to be engaged with a stepped shape generated according to the sizes of the diameters of the fifth layer 231 and the sixth layer 232. Thus, even if a plurality of coils are arranged, it is possible to limit the mounting space expansion (e.g., a height increase) between the first surface (e.g., first face 110A) and the shielding member 300 in the housing 100.

權(quán)利要求

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