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Inductive power transfer

專利號
US11177694B2
公開日期
2021-11-16
申請人
Hubbell Incorporated（US CT Shelton）
發(fā)明人
John Brower; Matthew Samojeden; Shadi AbuGhazaleh; Robert Simon
IPC分類
H02J7/00; H02J50/10; H02J50/12; H02J50/40; H02J50/80; H02J50/90; H02J7/02; H02J50/00
技術領域
power,receiver,coil,device,separable,transfer,in,wiring,electrical,processor
地域： CT CT Shelton

摘要

One embodiment provides a non-contact power transmitter device including a sealed housing provided at least partially within a surface, and a transmitter coil within the sealed housing configured to inductively transfer power to a power receiver device. The power transmitter device also includes a transmitter control unit coupled to the transmitter coil, a transceiver configured to communicate with the power receiver device, and an electronic processor coupled to the transmitter control unit and the transceiver. The electronic processor is configured to establish, using the transceiver, communication with the power receiver device, and negotiate power transfer requirements between the power transmitter device and the power receiver device. The electronic processor is also configured to control the transmitter coil unit to transfer power to the power receiver device.

說明書

FIG. 3 is a block diagram of a non-contact power transfer system in accordance with some embodiments;

FIG. 4 is a flowchart of a method of operating the non-contact power transfer system of FIG. 3 in accordance with some embodiments;

FIG. 5 is a block diagram of a multi-node non-contact power transfer system in accordance with some embodiments;

FIG. 6 is a flowchart of a method of operating a power transmitter device of the multi-node non-contact power transfer system of FIG. 5 in accordance with some embodiments;

FIGS. 7A-C illustrate an example implementation of the non-contact power transfer system of FIG. 3 implemented in a separable wiring device in accordance with some embodiments;

FIGS. 8A-C illustrate an example implementation of the non-contact power transfer system of FIG. 3 implemented in a separable wiring device in accordance with some embodiments;

FIG. 9 illustrates an example implementation of the non-contact power transfer system of FIGS. 7C and 8C in accordance with some embodiments;

FIG. 10A illustrates an example implementation of the non-contact power transfer system of FIG. 3 implemented in a separable wiring device in accordance with some embodiments;

權利要求

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