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Photosensitive element driving mechanism

專利號(hào)
US11178323B2
公開日期
2021-11-16
申請(qǐng)人
TDK TAIWAN CORP.(TW Taoyuan)
發(fā)明人
Chao-Chang Hu; Liang-Ting Ho
IPC分類
H04N5/225; G03B17/55; H02K41/035; H02N2/00; H02N2/02
技術(shù)領(lǐng)域
element,assembly,driving,substrate,circuit,package,first,movable,in,heat
地域: Taoyuan

摘要

A photosensitive element driving mechanism includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is movable relative to the fixed assembly, and the first movable assembly is configured to be connected to a photosensitive element. The photosensitive element corresponds to an optical element. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly. The first movable assembly includes a heat dissipation structure corresponding to the first driving assembly, the optical element or the photosensitive element.

說明書

When the first driving assembly 1-30 drives the circuit member body 1-1141 to move in a first moving direction (for example, the Y-axis), the amount of deformation of the first segment 1-SG1 and the third segment 1-SG3 is greater than the amount of deformation of the second segment 1-SG2. When the first driving assembly 1-30 drives the circuit member body 1-1141 to move in a second moving direction (for example, the X-axis), the amount of deformation of the first segment 1-SG1 and the third segment 1-SG3 is smaller than the amount of deformation of the second segment 1-SG2, and the first moving direction is not parallel to the second moving direction.

In some embodiments, the circuit member body 1-1141 and the movable cantilevers 1-1143 are integrally formed in one piece and are made of a flexible material. Furthermore, an insulating layer 1-1145 (the insulating element) is disposed on the substrate (the circuit member 1-114), which is continuously distributed on the movable cantilevers 1-1143, and a plurality of circuit elements 1-1147 (the conductive lines) is disposed on the substrate. These circuit elements 1-1147 are disposed on the insulating layer 1-1145 and are electrically connected to the photosensitive element 1-122

It should be noted that, only the photosensitive element 1-122 is disposed on the circuit member body 1-1141, thereby increasing the area of the photosensitive element 1-122 and improving the photographing effect.

權(quán)利要求

1
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