Please continue to refer to FIG. 3 and FIG. 4, in this embodiment, there is a gap formed between the first movable assembly 1-20 and the fixed assembly 1-10. Specifically, as shown in FIG. 3, the base plate 1-120 has a bottom surface 1-1201 perpendicular to the optical axis 1-O and facing the first movable assembly 1-20. In addition, a gap 1-G is formed between the substrate (the circuit member body 1-1141) and the bottom surface 1-1201 of the base plate 1-120.
As shown in FIG. 2 and FIG. 3, the first driving assembly 1-30 includes a plurality of first driving magnetic elements 1-MG1 and a plurality of first driving coils 1-CL1, these first driving magnetic elements 1-MG1 and the first driving coils 1-CL1 are correspondingly disposed on a plurality of sides of the substrate (the circuit member 1-114). In addition, the fixed assembly 1-10 further includes a plurality of supporting elements 1-140 disposed on the base plate 1-120, and the supporting elements 1-140 are configured to support the substrate. Based on the design of the first driving assembly 1-30 and the first movable assembly 1-20, the substrate can slide in the direction perpendicular to the main axis, for example, moving along the X-axis or Y-axis, so that the photosensitive element driving mechanism 1-100 can have the functions of optical image stabilization and shake compensation.
