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Photosensitive element driving mechanism

專利號(hào)
US11178323B2
公開日期
2021-11-16
申請(qǐng)人
TDK TAIWAN CORP.（TW Taoyuan）
發(fā)明人
Chao-Chang Hu; Liang-Ting Ho
IPC分類
H04N5/225; G03B17/55; H02K41/035; H02N2/00; H02N2/02
技術(shù)領(lǐng)域
element,assembly,driving,substrate,circuit,package,first,movable,in,heat
地域： Taoyuan

摘要

A photosensitive element driving mechanism includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is movable relative to the fixed assembly, and the first movable assembly is configured to be connected to a photosensitive element. The photosensitive element corresponds to an optical element. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly. The first movable assembly includes a heat dissipation structure corresponding to the first driving assembly, the optical element or the photosensitive element.

說明書

Based on the design of the supporting elements 1-140, the first movable assembly 1-20 is supported by the supporting elements 1-140 and is suspended in the outer frame 1-102, so that when the first driving assembly 1-30 drives the circuit member body 1-1141 and the photosensitive element 1-122 to move along the XY plane, the circuit member body 1-1141 does not collide with the base plate 1-120.

In other embodiments, the first driving assembly 1-30 is disposed between the first movable assembly 1-20 and the second movable assembly 1-40, and the supporting elements 1-140 are omitted. Thus, one end (the first end portion) of the first segment 1-SG1 and the connecting portion 1-SCP (the second end portion) are at the same level in the main axis. That is, the first end portion and the second end portion are on the same plane.

權(quán)利要求

1
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