Please refer to FIG. 3 and FIG. 5. FIG. 5 is a schematic diagram of a partial structure of the first movable assembly 1-20 and the first driving assembly 1-30 in another view according to an embodiment of the present disclosure. As shown in FIG. 3 and FIG. 5, the bottom surface 1-114BS of the substrate (the circuit member 1-114) faces the base plate 1-120, and a heat dissipation structure 1-150 may be formed on the bottom surface 1-114BS to increase the heat dissipation efficiency of the photosensitive element 1-122. Specifically, in this embodiment, the heat dissipation structure 1-150 may include a plurality of fin structures, but it is not limited thereto.
The heat dissipation structure 1-150 corresponds to the first driving assembly 1-30, the optical element or the photosensitive element 1-122. For example, as shown in FIG. 5, the heat dissipation structure 1-150 is surrounded by the first driving assembly 1-30. Furthermore, when viewed in the optical axis 1-O, the heat dissipation structure 1-150 overlaps the photosensitive element 1-122 or the optical element, and the heat dissipation structure 1-150 does not overlap the first driving assembly 1-30.
