As shown in FIG. 18, a second heat dissipation structure 3-HD2 is connected to a second heat conductive element 3-HE2, the second heat dissipation structure 3-HD2 is embedded in the integrated package substrate 3-110, and the second heat dissipation structure 3-HD2 does not penetrate the integrated package substrate 3-110. A third heat dissipation structure 3-HD3 is connected to a third heat conductive element 3-HE3 and the circuit assembly 3-103, and the third heat dissipation structure 3-HD3 does not penetrate the circuit assembly 3-103. In addition, a fourth heat dissipation structure 3-HD4 is embedded in the circuit assembly 3-103, and based on the configuration of the insulating structure layer 3-1030, the fourth heat dissipation structure 3-HD4 is electrically independent of the circuit wires 3-1031.
Based on the configuration of above-mentioned heat dissipation structures and the heat conductive element, the heat dissipation efficiency of the photosensitive element 3-120 can be improved, so that the stability of the digital image signal generated by the photosensitive element 3-120 can also be improved.
