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Photosensitive element driving mechanism

專利號
US11178323B2
公開日期
2021-11-16
申請人
TDK TAIWAN CORP.（TW Taoyuan）
發(fā)明人
Chao-Chang Hu; Liang-Ting Ho
IPC分類
H04N5/225; G03B17/55; H02K41/035; H02N2/00; H02N2/02
技術領域
element,assembly,driving,substrate,circuit,package,first,movable,in,heat
地域： Taoyuan

摘要

A photosensitive element driving mechanism includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is movable relative to the fixed assembly, and the first movable assembly is configured to be connected to a photosensitive element. The photosensitive element corresponds to an optical element. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly. The first movable assembly includes a heat dissipation structure corresponding to the first driving assembly, the optical element or the photosensitive element.

說明書

It is worth noting that the above heat dissipation structures are electrically independent of the circuit wires 3-1031. In addition, in some embodiments, the heat conductive elements can be omitted, which means that the photosensitive element 3-120 can be connected to the base 3-102 through the first heat dissipation structure 3-HD1. Furthermore, the integrated package substrate 3-110 is connected to the base 3-102 through the first heat dissipation structure 3-HD1 as well.

Next, please refer to FIG. 19, which is an enlarged structural diagram of the integrated package substrate 3-110 according to some embodiments of the present disclosure. In this embodiment, the integrated package substrate 3-110 includes a third insulating layer 3-1101, a fourth insulating layer 3-1102, an intermediate layer 3-1103, a first circuit element 3-CE1, and a second circuit element 3-CE2.

權利要求

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