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Photosensitive element driving mechanism

專利號
US11178323B2
公開日期
2021-11-16
申請人
TDK TAIWAN CORP.(TW Taoyuan)
發(fā)明人
Chao-Chang Hu; Liang-Ting Ho
IPC分類
H04N5/225; G03B17/55; H02K41/035; H02N2/00; H02N2/02
技術(shù)領(lǐng)域
element,assembly,driving,substrate,circuit,package,first,movable,in,heat
地域: Taoyuan

摘要

A photosensitive element driving mechanism includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is movable relative to the fixed assembly, and the first movable assembly is configured to be connected to a photosensitive element. The photosensitive element corresponds to an optical element. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly. The first movable assembly includes a heat dissipation structure corresponding to the first driving assembly, the optical element or the photosensitive element.

說明書

It is worth noting that the electrical connection assembly 3-1021 penetrates the body 3-1020 of the base 3-102, and the electrical connection assembly 3-1021 is electrically independent of the body 3-1020 of the base 3-102. In addition, when viewed along the direction perpendicular to the optical axis 3-O (for example, the X-axis), the base 3-102, the integrated package substrate 3-110, and the photosensitive element 3-120 do not overlap each other.

Similar to the photosensitive module 3-300, the first heat dissipation structure 3-HD1 of the photosensitive module 3-400 also is in direct contact with the photosensitive element 3-120 and the base 3-102, and when viewed along the optical axis 3-O, the area of the first heat dissipation structure 3-HD1 is less than or equal to the area of the photosensitive element 3-120.

權(quán)利要求

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