Photosensitive element driving mechanism
摘要
說明書
The present disclosure provides a photosensitive module that can be installed in various electronic devices. The photosensitive module may include a base 3-102, a circuit assembly 3-103, an integrated package substrate 3-110, and a photosensitive element 3-120. The photosensitive element 3-120 can be electrically connected to the circuit assembly 3-103 or the integrated package substrate 3-110. The integrated package substrate 3-110 may be a semiconductor embedded substrate (SESUB), which has a plurality of electronic components, and those electronic components are enclosed in the integrated package substrate 3-110 without being exposed to external environment. Based on the configuration of the integrated package substrate 3-110, the photosensitive module can be equipped with more electronic components and can have a smaller volume at the same time.
The base 3-102 may be made of a material with high thermal conductivity coefficient to improve the overall heat dissipation effect of the photosensitive module. Furthermore, in some embodiments, the photosensitive module may further include a plurality of heat dissipation structures connected to the photosensitive element 3-120. The configuration of the heat dissipation structure can improve the heat dissipation efficiency of the photosensitive module.
