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Photosensitive element driving mechanism

專利號
US11178323B2
公開日期
2021-11-16
申請人
TDK TAIWAN CORP.（TW Taoyuan）
發(fā)明人
Chao-Chang Hu; Liang-Ting Ho
IPC分類
H04N5/225; G03B17/55; H02K41/035; H02N2/00; H02N2/02
技術(shù)領(lǐng)域
element,assembly,driving,substrate,circuit,package,first,movable,in,heat
地域： Taoyuan

摘要

A photosensitive element driving mechanism includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is movable relative to the fixed assembly, and the first movable assembly is configured to be connected to a photosensitive element. The photosensitive element corresponds to an optical element. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly. The first movable assembly includes a heat dissipation structure corresponding to the first driving assembly, the optical element or the photosensitive element.

說明書

The integrated package substrate 4-110 is disposed on the circuit assembly 4-103, and the photosensitive module 4-100 further includes a plurality of electrical connection portions, and the electrical connection portion may be a solder 4-SD. The integrated package substrate 4-110 is electrically connected to the circuit assembly 4-103 via the solder 4-SD, for example, by the surface-mount technology (SMT). The surface-mount technology may be, for example, a ball grid array (BGA) packaging technology. As shown in FIG. 23, the integrated package substrate 4-110 is connected to the circuit wires 4-1031 through the plurality of solder 4-SD.

Furthermore, the photosensitive module 4-100 may further include a reinforcing material 4-135, which is in direct contact with the electrical connection portion (the solder 4-SD), the integrated package substrate 4-110, and the circuit assembly 4-103. The reinforcing material 4-135 may be a non-conductive adhesive or a head conductive glue, but it is not limited thereto. In some embodiments, the reinforcing material 4-135 and the second insulating layer 4-1034 may be integrally formed. For example, they may be made of a polymer.

權(quán)利要求

1
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