Photosensitive element driving mechanism
摘要
說明書
The integrated package substrate 4-110 may be a semiconductor embedded substrate (SESUB), but it is not limited thereto. The integrated package substrate 4-110 may have a plurality of first electronic components 4-115, and these first electronic components 4-115 may be various electronic components, such as integrated circuit (IC) chips, capacitors, resistors, sensors, and so on. It should be noted that the first electronic components 4-115 are housed in the body of the integrated package substrate 4-110 without being exposed to external environment.
The photosensitive element 4-120 is disposed on the integrated package substrate 4-110 and is electrically connected to the integrated package substrate 4-110 by a plurality of lead wires 4-121. The photosensitive element 4-120 is configured to receive a light beam traveling along the optical axis 4-O so as to generate a digital image signal.
