As shown in FIG. 23, a second heat dissipation structure 4-HD2 is connected to a second heat conductive element 4-HE2, the second heat dissipation structure 4-HD2 is embedded in the integrated package substrate 4-110, and the second heat dissipation structure 4-HD2 does not penetrate the integrated package substrate 4-110. A third heat dissipation structure 4-HD3 is connected to a third heat conductive element 4-HE3 and the circuit assembly 4-103, and the third heat dissipation structure 4-HD3 does not penetrate the circuit assembly 4-103. In addition, a fourth heat dissipation structure 4-HD4 is embedded in the circuit assembly 4-103, and based on the configuration of the insulating structure layer 4-1030, the fourth heat dissipation structure 4-HD4 is electrically independent of the circuit wires 4-1031.
Based on the configuration of above-mentioned heat dissipation structures and the heat conductive element, the heat dissipation efficiency of the photosensitive element 4-120 can be improved, so that the stability of the digital image signal generated by the photosensitive element 4-120 can also be improved.
