Photosensitive element driving mechanism
摘要
說明書
The intermediate layer 4-1103 is disposed between the third insulating layer 4-1101 and the fourth insulating layer 4-1102, and the first electronic component 4-115 is disposed in the intermediate layer 4-1103. The first circuit element 4-CE1 is disposed between the third insulating layer 4-1101 and the intermediate layer 4-1103, the second circuit element 4-CE2 is disposed between the intermediate layer 4-1103 and the fourth insulating layer 4-1102, and the intermediate layer 4-1103 is made of a material different from that of the third insulating layer 4-1101 or the fourth insulating layer 4-1102. For example, the material of the intermediate layer 4-1103 is softer than the materials of the third insulating layer 4-1101 and the fourth insulating layer 4-1102
The first circuit element 4-CE1 and the second circuit element 4-CE2 may be metal pads, which are connected to each other by the through hole 4-110H. In addition, a plurality of electronic units 4-117 (such as integrated circuit wafers) may be disposed on the third insulating layer 4-1101, and the integrated package substrate 4-110 further includes a packaging layer 4-1105 to cover the electronic units 4-117 to prevent them from exposure. The electronic units 4-117 may be electrically connected to the solder 4-SD through the plurality of through holes 4-110H, the first circuit element 4-CE1 and the second circuit element 4-CE2.
