Please return to FIG. 23 again. In this embodiment, the photosensitive module 4-100 further includes a second electronic component 4-155 disposed on a surface 4-110S of the integrated package substrate 4-110. It is worth noting that the second electronic component 4-155 and the photosensitive element 4-120 are disposed on the same side of the integrated package substrate 4-110.
Please refer to FIG. 25, which is a schematic cross-sectional structural diagram of a photosensitive module 4-200 according to another embodiment of the present disclosure. In this embodiment, the base 4-102 has an opening 4-102H corresponding to the photosensitive element 4-120. Specifically, the photosensitive element 4-120 is disposed in the opening 4-102H. When viewed along the direction perpendicular to the optical axis 4-O (for example, the X-axis), the photosensitive element 4-120 overlaps at least a portion of the base 4-102.
