Photosensitive element driving mechanism
摘要
說明書
The photosensitive module 4-200 includes a plurality of first electrical connection portions 4-SD1 and a plurality of second electrical connection portions 4-SD2, and the first electrical connection portion 4-SD1 and the second electrical connection portion 4-SD2 may be solder. The integrated package substrate 4-110 is electrically connected to the circuit assembly 4-103 via the first electrical connection portions 4-SD1, which means that the integrated package substrate 4-110 is connected to the base 4-102 via the circuit assembly 4-103. The photosensitive element 4-120 is electrically connected to the integrated package substrate 4-110 via the second electrical connection portions 4-SD2, and the first electrical connection portions 4-SD1 and the second electrical connection portions 4-SD2 are disposed on the same side surface (such as the bottom surface) of the integrated package substrate 4-110.
The integrated package substrate 4-110 has a through hole 4-110P corresponding to the photosensitive element 4-120, so that external light can enter the photosensitive element 4-120 through the through hole 4-110P. The transparent element 4-125 covers the through hole 4-110P to prevent dust or particles from falling onto the photosensitive element 4-120.
