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Photosensitive element driving mechanism

專利號
US11178323B2
公開日期
2021-11-16
申請人
TDK TAIWAN CORP.（TW Taoyuan）
發(fā)明人
Chao-Chang Hu; Liang-Ting Ho
IPC分類
H04N5/225; G03B17/55; H02K41/035; H02N2/00; H02N2/02
技術(shù)領(lǐng)域
element,assembly,driving,substrate,circuit,package,first,movable,in,heat
地域： Taoyuan

摘要

A photosensitive element driving mechanism includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is movable relative to the fixed assembly, and the first movable assembly is configured to be connected to a photosensitive element. The photosensitive element corresponds to an optical element. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly. The first movable assembly includes a heat dissipation structure corresponding to the first driving assembly, the optical element or the photosensitive element.

說明書

FIG. 25 is a schematic cross-sectional structure diagram of a photosensitive module 4-200 according to another embodiment of the present disclosure.

FIG. 26 is a schematic cross-sectional structure diagram of a photosensitive module 4-300 according to another embodiment of the present disclosure.

FIG. 27 is a schematic cross-sectional structure diagram of a photosensitive module 4-400 according to another embodiment of the present disclosure.

FIG. 28 is a schematic cross-sectional structure diagram of a photosensitive module 4-500 according to another embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE ILLUSTRATIVE EMBODIMENTS

權(quán)利要求

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