In an embodiment, the second component carrier comprises at least one electrically conductive interlayer connect, in particular at least one via filled with electrically conductive material, extending between at least two second electrically conductive layer structures, in particular through a second electrically insulating layer structure of the second component carrier. By connecting different patterned electrically conductive layers of the second component carrier by at least one via filled with an electrically conductive material such as copper, the vertical interconnect functionality of the mentioned via may be converted into a horizontal coupling function after rotating the second component carrier by 90°. Thus, the electric connection circuitry may be further refined by implementing one or more vias in the second component carrier.

In an embodiment, the electronic device comprises at least one first component embedded in and/or surface-mounted on the first component carrier. In particular, the at least one first component may be electrically connected to at least one second electrically conductive layer structure of the second component carrier. Thus, the second component carrier may be implemented for electrically connecting different terminals (such as pads) of at least one preferably embedded component of the first component carrier with very small space consumption and with short current or signal paths. It may be particularly advantageous to embed both the component and the second component carrier in the same cavity of the first component carrier. This combines a simple manufacturability with a compact design and a low loss electric connection of the one or more components.