In an embodiment, the electronic device comprises at least one second component being surface-mounted on and/or embedded in the second component carrier and being inserted into the cavity of the first component carrier or being attached to the exterior sidewall of the first component carrier. Highly advantageously, also the second component carrier may be equipped with one or more embedded or surface mounted components to be inserted together with the layer stack into the cavity or to be attached together with the layer stack to a sidewall of the first component carrier. This measure allows extending the electronic functionality of the electronic device and also allows vertically embedding components into the electronic device in a space-saving way.

In an embodiment, the second component carrier comprises a continuous second electrically conductive layer, in particular sandwiched between two second electrically insulating layers. Such a continuous electrically conductive layer may contribute to a task such as shielding of electromagnetic radiation, efficiently removing heat (for instance generated by an embedded component during operation of the electronic device) out of an interior of the package-type electronic device, etc.