In an embodiment, the method comprises connecting at least one further electrically conductive layer structure to the first component carrier and to the second component carrier for establishing an electrically conductive connection between a second electrically conductive layer structure of the second component carrier on the one hand and at least one first electrically conductive layer structure of the first component carrier and/or a component embedded in the first component carrier on the other hand. Thus, the at least one further electrically conductive layer structure may be attached to both connected component carriers to thereby bridge or close a gap between exposed respective electrically conductive layer structures of the component carriers by the at least one further electrically conductive layer structure.

In an embodiment, the method comprises forming, after inserting the second component carrier in the cavity, a further cavity in the first component carrier, and inserting a component or a third (or a further second) component carrier in the further cavity. Thus, the described principle may be applied as well to embodiments in which multiple cavities are formed in the first component carrier. Thus, a modular construction set is provided for manufacturing even complex electronic devices on a system level.