The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1, 2, 3, 4, 5, 6, 7, 8 and 9 illustrate cross-sectional views of structures obtained during performance of a method of manufacturing an electronic device shown in FIG. 10, according to an exemplary embodiment of the invention.
FIGS. 11, 12, 13 and 14 illustrate cross-sectional views of structures obtained during performance of a method of manufacturing an electronic device according to another exemplary embodiment of the invention.
FIGS. 15, 16, 17 and 18 illustrate cross-sectional views of electronic devices according to exemplary embodiments of the invention.
FIG. 19 illustrates a cross-sectional view of structures obtained during performance of a method of manufacturing an electronic device, shown in a cross-sectional view in FIG. 20, according to still another exemplary embodiment of the invention.
FIGS. 21, 22, 23 and 24 show cross-sectional views of second component carriers to be inserted in a cavity of or to be attached to a side wall of a first component carrier for manufacturing an electronic device according to an exemplary embodiment of the invention.
FIG. 25 illustrates a cross-sectional view of an electronic device according to another exemplary embodiment of the invention.
