The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.

Before, referring to the drawings, exemplary embodiments will be described in further detail, some basic considerations will be summarized based on which exemplary embodiments of the invention have been developed.

According to an exemplary embodiment of the invention, a package-type electronic device with high-density vertical connections may be provided which may be composed of two (or more) interconnected component carriers in different orientations.

In highly integrated package-type electronic devices, a short connection between one component and another (for instance stacked) component, in particular a semiconductor chip, is crucial. Due to the enormous amount of needed vertical connections in such a scenario, the consumed space is an important bottleneck of present package-type electronic devices. There are different approaches, for instance connecting components placed side by side, z-connections with copper filled vias and thus space consuming, etc. Each of these conventional approaches has certain limitations.

In view of the foregoing, exemplary embodiments of the invention provide a short and space saving z-axis connection architecture by using homogeneous material within a package composed of two (or more) interconnected component carriers.