Before describing this manufacturing process in detail, construction of the plate-shaped component carrier-type electronic device 100 according to the exemplary embodiment shown in FIG. 10 will be explained.
The electronic device 100 shown in FIG. 10 comprises a first component carrier 102 which is here embodied as a printed circuit board (PCB). The first component carrier 102 comprises a vertical stack of first electrically conductive layer structures 104 and first electrically insulating layer structure 106 (which may comprise epoxy resin and reinforcing glass fibers, for instance may be embodied as FR4; more generally, any appropriate ceramic materials, substrate materials, organic materials, etc., may be used). The first electrically conductive layer structures 104 are embodied as patterned electrically conductive layers (more specifically patterned copper films) as well as vertical interconnects (more specifically laser vias filled with copper). Although not illustrated in FIG. 10, the first component carrier 102 comprises a cavity 114 which can be seen, for instance, in FIG. 1.
