Two second component carriers 108, which are here embodied as IC substrates or smaller (compared to the first component carrier 102) PCBs, also form part of the electronic device 100 and have been inserted completely and in a 90° rotated orientation relative to the first component carrier 102 into the cavity 114 of the first component carrier 102 (compare FIG. 2). More precisely, an embedded component 122 (for instance a semiconductor chip) with pads 172 has been placed in the cavity 114 together with the two second component carriers 108 in a lateral sandwich configuration. Each of the second component carriers 100 also comprises a stack of second electrically conductive layer structures 110 (patterned copper foils in the present embodiment) and a second electrically insulating layer structure 112 (which may comprise epoxy resin and reinforcing glass spheres or fibers) in between. The second component carriers 108 are inserted completely into the cavity 114 of the first component carrier 102 in their 90° tilted state so that a stacking direction 116 (vertically according to FIG. 10) of the first component carrier 102 is oriented perpendicular with regard to another different stacking direction 117 (horizontally according to FIG. 10) of the second component carriers 108 (which are aligned parallel to one another).